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Emeka Amalu

01642 342450
Job title:
Senior Lecturer in Mechanical Engineering
School of Science & Engineering
More about Emeka Amalu  
Research institute:
Technology Futures Institute

About Emeka Amalu

Emeka Amalu

Emeka Amalu
Senior Lecturer in Mechanical Engineering, School of Science & Engineering
T: 01642 342450
Research institute: Technology Futures Institute

Dr Emeka Amalu is a Senior Lecturer at Teesside University, Middlesbrough, UK. He is a Chartered Engineer (CEng) and a member of the Institution of Mechanical Engineers (IMechE) as well as the Institution of Engineering and Technology (IET). Emeka achieved the status of Fellow of Higher Education Academy (FHEA). Dr Amalu’s remit is to combine scientific knowledge, mathematics and modelling skills to provide solutions to societal engineering problems. 

Dr Amalu has very relevant teaching, research skills and experience. He has taught a range of mechanical engineering and mathematics modules over his thirteen year academic career. His previous roles included Postdoctoral Research Fellow at the University of Wolverhampton (UoW), UK; part-time lecturer at the University of Greenwich at Medway, UK; as well as Senior Lecturer at the University of Benin, Nigeria. His effective teaching practice earned him a nomination for the Inspirational Lecturer Award 2013/14 and 2015/16 sessions awarded by the UoW Student Union.

Dr Emeka Amalu is research active. His areas of interest include sustainable energy technologies, electronics packaging reliability and systems modelling as well as characterisation of soft solids. He employs experimental mechanics and modelling in his research. His modelling capabilities include 3-D Static Structural, Steady State Thermal and Computational Fluid Dynamics. Utilising Computer Aided Engineering (CAD) coupled with ANSYS Finite Element Analysis (FEA), Emeka models the response of structural systems to applied loads and predicts their performance. He has a PhD completion and currently supervises two PhD students. In addition, he has experience in proposal development and has submitted to EU Horizon 2020 and Royal Society calls.

Dr Amalu is a visiting Research Fellow to Kwame Nkrumah University of Science & Technology, Ghana and collaborates with many academic research groups in the UK, Europe, USA, Asia and Africa. Dr Amalu has over 40 publications in high impact factor journals and has published over nine journal articles and five conference papers during his PhD studies, which earned him the prize for the best PhD Student 2012, awarded by the School of Engineering, UoG, London. His research outputs were included in the UoW Research Excellence Framework (REF) submission under General Engineering in 2014.

Research interests

The areas of my research expertise are in the fields of electronics, soft solids, sustainable energy and systems’ modelling:

The areas include electronics manufacturing, assembly, reliability and integrity of microelectronic solder joints. In addition, I am also interested in study on the thermo-mechanical reliability of 3-D electronics packaging using components which include flip chip package and package-on-package. I am highly experienced in experimental mechanics and have designed and conducted experiments which required operating a vast array of equipment used in electronics assembly, reliability, testing and damage mechanics. Moreover, I am experienced in the statistical analysis of large data pool.

(II) Materials
I conduct research focused on rheological characterisation of solder pastes to inform on their stencil print performance behaviour. This area of research is stretched to include investigation on thermo-fatigue and durability of solder materials used as solder joints to assemble miniaturised electronic components on the substrate printed circuit board.

(III) Sustainable energy
Recently, I have advanced my research expertise to include photovoltaics technology. I conduct research focused on improving the cell, contact and interconnection technologies of PV modules for improved output power, power conversion efficiency and the interconnection reliability especially for operations in hot temperature climates. This involves optimisation of the design parameters associated with thermal management and structural integrity of the PV module assembly for increased operational reliability. 

(IV) Systems Modelling
I am an expert in static structural and steady state thermal modelling of systems. I am also knowledgeable in the application of ANSYS CFX package to model fluid behaviour. I can confirm that I employ Computer Aided Engineering (CAE) and Finite Element Analysis (FEA) using ANSYS software to model and provide solutions to engineering problems associated with reliability predictions of systems and processes, with specific emphasis on electronics and photovoltaics interconnections, assembly, packaging and manufacture.


[1] O.O. Ogbomo, E.H. Amalu, N.N. Ekere and P.O. Olagbegi (2016), A review of photovoltaic module technologies for increased performance in tropical climate. Renewable and Sustainable Energy Reviews. In Press.
[2] E.H. Amalu and N.N. Ekere (2016), Modelling evaluation of Garofalo-Arrhenius creep model for lead-free solder joints in surface mount electronic component assemblies. Journal of Manufacturing Systems, vol. 39. pp. 9-23.
[3] M.T.Zarmai, N.N.Ekere, C.F.Oduoza and E.H. Amalu (2016), Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly. Microelectronics Reliability, vol. 59. pp. 117-125.
[4] E.H. Amalu, N.N. Ekere, M.T. Zarmai, G. Takyi (2015), Optimisation of thermo-fatigue reliability of solder joints in surface mount resistor assembly using Taguchi method. Finite Elements in Analysis and Design, vol. 107. pp.13-27.
[5] M.T. Zarmai,N.N.Ekere,C.F.Oduoza and E.H.Amalu (2015), A review of interconnection technologies for improved crystalline silicon solar cell photovoltaic module assembly. Applied Energy, vol. 154. pp.173-182.
[6] M. T. Zarmai, N. N. Ekere, C. F. Oduoza and E.H. Amalu (2015),Effect of intermetallic compounds on thermo-mechanical reliability of lead-free solder joints in solar cell assembly, International Journal of Mechanical Engineering (IJME), vol. 4, Issue 6, pp.29-38.
[7] E.H.Amalu, N.N. Ekere (2012), Damage of lead-free solder joints in flip chip assemblies subjected to high-temperature thermal cycling. Computational Materials Science, vol.65. pp.470-484.
[8] E.H.Amalu, N.N. Ekere (2012), High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. Microelectronics Reliability, vol. 52. pp.2982-2994.
[9] E.H. Amalu, N.N. Ekere (2012), Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Microelectronics Reliability, vol.52.pp. 2731-2743.
[10] E.H. Amalu, N.N. Ekere (2012), High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology,vol.212. pp. 471-488.
[11] E.H.Amalu, N.N. Ekere, R.S. Bhatti, G. Takyi, A.O.A.Ibhadode (2012) Numerical Investigation of Thermo-Mechanical Behaviour of Ball Grid Array Solder Joint at High Temperature Excursion. Advanced materials research Trans Tech Publications Switzerland, vol. 367. pp. 287-292.
[12] K.C. Otiaba, N.N. Ekere, E.H.Amalu, R.S. Bhatti, S.Mallik (2012), Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R&D Challenges. Advanced Materials Research Trans Tech Publications Switzerland, vol. 367.pp. 301-307.
[13] K.C. Otiaba , R.S. Bhatti, N.N. Ekere,S.Mallik, M.O. Alam, E.H. Amalu, M. Ekpu, (2012), Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, vol. 52.pp.1409–1419.
[14] E.H.Amalu, N.N.Ekere, S.Mallik, (2011), Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, vol. 32.pp. 3189-3197.
[15] E.H.Amalu, W.K.Lau ,N.N.Ekere, R.S. Bhatti, S.Mallik ,K.C. Otiaba , G. Takyi (2011), A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits, Microelectronics Engineering, vol. 88. pp. 1610-1617.
[16] G.Takyi, E.H. Amalu, P.K. Bernasko (2011), Effect of Solder Joint Integrity on the Thermal Performance of TEC for a 980nm Pump Laser Module. Soldering & Surface Mount Technology, vol.23. Iss2.pp. 115-119.
[17] K.C. Otiaba, N.N. Ekere, R.S. Bhatti, S. Mallik, M.O. Alam, E.H. Amalu (2011), Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, vol.51. Iss. 12.pp. 2031-2043.
[18] E.H.Amalu, A.O.A. Ibhadode (2007),3Hp Petrol Engine Piston Manufacture by Reverse Engineering Approach. Nigerian Journal of Engineering Research and Development. vol. 5, No.4, pp.16-21.
[19] E.H. Amalu, A.O.A. Ibhadode, A.E. Ameh (2007), Manufacture of a 3 hp Petrol Engine Connecting Rodby Reverse Engineering Approach. Nigerian Journal of Engineering Research and Development.vol. 6, No.1, pp. 28-35.
[20] E.H. Amalu, A.O.A. Ibhadode (2007),3Hp Petrol Engine Block Fabrication by Reverse Engineering Approach.Nigerian Journal of Engineering Research and Development. vol.6, No.2.
[21] E.H.Amalu, A.O.A. Ibhadode (2007), Engine Spare Parts Production through Copy Manufacture and Substitution Approach. Advanced Materials Research, Trans Tech Publication Ltd. Switzerland. vol.18-19.pp. 475-480.
[22] A.O.A.Ibhadode, E.H. Amalu (2006), Indigenous Development of a 3HP Petrol Engine. Nigerian Journal of Engineering Research & Development.vol.5, No. 1,pp. 20-35.

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